Enlarge

Wafer bonding : applications and technology

Publication Data

Title Wafer bonding : applications and technology
Contributors M. Alexe, U. Gösele
Publisher Springer
Publication date 2004
Publication location Berlin
Language English

Topics

Semiconductors :: Bonding
Semiconductor wafers

Catalogue Data

OBNB ID GBA470927
ISBN 10 3540210490
ISBN 13 n/a
Type BibliographicResource, Book
Dewey Classification 621.38152

ISBD

P1053 xv, 499 p.
P1042 Includes bibliographical references and index.

Buy a copy

OBNB doesn't sell books, but you may be able to find a copy at one of these websites:

Wafer bonding : applications and technology. ISBN 3540210490. Published by Springer in 2004. Publication and catalogue information, links to buy online and reader comments.

obnb.uk is a Good Stuff website.