Machine generated contents note: 1. Thin film applications to microelectronic technology; 2. Thin film deposition; 3. Surface energy in thin films; 4. Atomic diffusion in crystalline solids; 5. Applications of diffusion equation; 6. Elastic stress and strain in thin films; 7. Surface kinetic processes on thin films; 8. Interdiffusion and reaction in thin films; 9. Grain boundary diffusion; 10. Irreversible processes in interconnect and packaging technology; 11. Electromigration in metals; 12. Electromigration induced failure in Al and Cu interconnects; 13. Thermomigration; 14. Stress migration in thin films; 15. Reliability science and analysis; Appendices: A. A brief review of thermodynamic functions; B. Defect concentration in solids; C. Step-by-step derivation of Huntington's electron wind force; D. Elastic constants tables and conversions; E. Terrace size distribution in Si MBE; F. Interdiffusion coefficient; G. Units, tables of conversions, period table.
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Electronic thin film reliability by K. N. Tu. ISBN 9780521516136. Published by Cambridge University Press in 2011. Publication and catalogue information, links to buy online and reader comments.
