3D IC stacking technology :: ISBN 9780071741958 :: McGraw-Hill Professional 2011 :: OBNB, the Open British National Bibliography

Publication Data

Title 3D IC stacking technology
Alternative Title Three D IC stacking technology
Contributors Banqiu Wu, Ajay Kumar, Sesh Ramaswami
Publisher McGraw-Hill Professional
Publication date 2011
Publication location New York
Language English

Topics

Three-dimensional integrated circuits
015728835

Catalogue Data

OBNB ID GBB105793
ISBN 10 007174195X
ISBN 13 9780071741958
Type BibliographicResource, Book
Dewey Classification 621.38153

ISBD

P1008>1st 1st ed.
P1053 xviii, 521 p.
P1042 Includes bibliographical references and index.

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3D IC stacking technology. ISBN 9780071741958. Published by McGraw-Hill Professional in 2011. Publication and catalogue information, links to buy online and reader comments.