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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture

E. -H. Wong

Publication Data

Title Robust design of microelectronics assemblies against mechanical shock, temperature and moisture
Author E. -H. Wong
Contributor Y. W. Mai
Publisher Elsevier
Publication date 2015
Publication location Amsterdam
Language English

Topics

Electronic packaging

Catalogue Data

OBNB ID GBB419604
ISBN 10 1845695283
ISBN 13 9781845695286
Type BibliographicResource, Book
Dewey Classification 621.381046

ISBD

P1053 xviii, 457 pages
P1042 Includes bibliographical references and index.

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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture by E. -H. Wong. ISBN 9781845695286. Published by Elsevier in 2015. Publication and catalogue information, links to buy online and reader comments.