Temperature induced failure Moisture induced failure Mechanical shock induced failure Adhesive interconnects and viscoelasticity Concluding remarks Programs and macro files Temperature induced failure Moisture induced failure Mechanical induced failure
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Robust design of microelectronics assemblies against mechanical shock, temperature and moisture by E. -H. Wong. ISBN 9780857099112. Published by Woodhead Publishing in 2015. Publication and catalogue information, links to buy online and reader comments.
