Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability

Publication Data

• Title Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
• Author Michael Pecht
• Publisher Wiley
• Publication date 1994
• Publication location New York
• Language English

Topics

• Electronic packaging :: Design
• Hybrid integrated circuits :: Design and construction
• 009742783

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability by Michael Pecht. ISBN 0471594466. Published by Wiley in 1994. Publication and catalogue information, links to buy online and reader comments.